Traditional lithography is often bottlenecked by costly masks and long turnaround times. To break free from physical masks, driving exposure directly with digital patterns is a much more efficient approach. This desktop unit eliminates the need for massive facility infrastructure. It easily achieves 1.5μm resolution while remaining compatible with a wide range of photoresists and flexible substrates, making it perfect for rapid prototyping in the lab.
Get a QuoteKey Advantages
The micromirror array projects digital patterns directly onto the substrate, completely eliminating the long lead times and high costs of custom physical masks. It not only supports high-precision direct writing on various flexible materials, but its compact frame also easily fits into a glovebox or on a standard lab bench. By importing files to directly drive the exposure, it bypasses the tedious intermediate steps of mask making and transfer printing, making the prototyping of micro/nano structures for high-mix, low-volume runs truly instant and highly adaptable.
Working Principle
The computer converts CAD designs into digital signals and directly controls the core component inside—the digital micromirror array. A UV light source shines onto it, and the rapid flipping of the micromirrors determines whether light is reflected onto the substrate. Combined with a high-precision motion stage, the laser beam scans and exposes the substrate line by line, almost like a pen drawing. Because the entire process generates patterns straight from digital models, it completely skips mask fabrication, delivering highly efficient DMD laser direct writing.
Application Fields
1.MEMS sensor fabrication: rapidly processing fine electrodes and mechanical structures.
2.Microfluidics: direct lithography of microchannels on PDMS or glass.
3.2D materials research: rapid patterning of graphene and quantum dots.
4.Biomedical devices: manufacturing biosensors and microneedle arrays.
FAQ
Q1: If the photoresist coating is thick, or if a non-flat flexible substrate is used, will it mess up the exposure?
A: No. The optical design accounts for depth of focus. For thick resist layers or slightly uneven substrates, you can adjust the focal length and exposure dose directly via software. The built-in leveling mechanism and alignment light source also ensure crisp structures on irregular or non-standard substrates.
Q2: With digital micromirror technology, can it really meet the sidewall verticality requirements for microfluidic chips?
A: Absolutely. Although this is a maskless laser writer, it uses precise light spot projection and multi-level dose control to create sharp-edged structures in the resist. By pairing it with the right development process, it can produce molds with highly vertical sidewalls that meet the high aspect ratio demands of microfluidic channels.
Q3: Is changing objectives a hassle? Does it require recalibration?
A: It's very simple, thanks to a quick-release interface. The software for this microfabrication system has built-in parameter configurations for different objectives. Once you swap the lens, the software automatically loads the correct writing field dimensions and calibration data—no manual recalibration of the complex laser optical path is needed.
Technical Specifications
|
Core Parameters |
Standard |
Advanced |
|
Minimum Feature Size |
1.5 μm |
1.5 μm |
|
Max Exposure Area |
70 × 70 mm² |
110 × 110 mm² |
|
Alignment Accuracy |
2 μm |
1 μm |
|
Writing Speed |
77 mm²/min |
220 mm²/min |
|
Substrate Size |
Up to 4" wafers |
Up to 5" masks |
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