Semiconductor Metrology Equipment | Wafer Inspection

Key Advantages

Specialized wear-resistant probes ensure extremely low contact resistance and long-term stability. Together with fully automatic wafer handling and vision alignment modules, manual operation time is drastically reduced. The powerful analysis software generates 2D/3D resistivity distribution maps with one click and supports quick data export, making complex electrical testing efficient and intuitive.

Working Principle

The wafer is vacuum-fixed on a precision stage and aligned via a vision system. An internal constant current source applies a known current to the four probes and simultaneously measures the voltage change between the inner probes, instantly calculating the point's resistivity based on the Sheet Resistance Measurement formula. As the probes move point-by-point across the surface along a preset path, a soft-landing pneumatic buffer ensures good ohmic contact, achieving true Non-Destructive Testing. Once data collection is complete, the software rapidly completes the Wafer Resistivity Mapping, generating intuitive 2D/3D color maps. For Highly Resistive Materials like semi-insulating SiC, the system automatically switches to a high-impedance module, ensuring stable data output across a wide measurement range.

Application Fields

1.Semiconductor wafer fabrication: Resistivity testing for silicon, SiC, and GaN.
2.Thin-film materials R&D: Conductivity evaluation for metal and transparent conductive films.
3.Photovoltaics and new energy: Sheet resistance uniformity testing for solar cells.
4.Research and universities: Electrical characterization for 2D materials and conductive polymers.

FAQ

Q1: Can your tester measure materials with extremely high resistance?

A: Yes. The equipment is equipped with a high-impedance voltage measurement module. Combined with an ultra-weak test current, it can accurately measure highly resistive materials such as semi-insulating SiC. To ensure accuracy, the internal components feature strict electromagnetic shielding to eliminate external interference.

Q2: Will the testing process scratch or damage the wafer surface?

A: No. The probes use ultra-fine tungsten or special alloy tips, paired with a precision soft-landing pneumatic buffer mechanism. While ensuring good ohmic contact, it minimizes mechanical pressure on the wafer surface, truly achieving non-destructive testing. Tested samples can safely proceed to subsequent processes.

Q3: Does the software system support customized test reports?

A: Yes. The system features powerful built-in data analysis software. Operators can customize test points, scan paths, and pass/fail criteria. After testing, the software automatically generates reports containing average values, standard deviations, and mapping charts, for quality traceability.

Technical Specifications